According to the latest report by SEMI, in the second quarter of 2025, the global semiconductor equipment shipment amount increased by 24% year-on-year to 33.07 billion US dollars. The recovery of the electronic manufacturing industry is driving the accelerated iteration of SMT technology. Miniaturization processes breakthroughs, intelligent production line upgrades, and green manufacturing transformation have become the core growth drivers of the industry.
From March 25th to 27th, 2026, the Productronica China, the Munich Shanghai Electronic Equipment Exhibition, will kick off at the Shanghai New International Expo Center (Exhibitions E1-E5 and W1-W3). With an exhibition area of nearly 100,000 square meters and over 1,000 participating companies, this event will showcase the technological advancements in SMT.
Miniaturization Campaign: Entering the "Micron-level Assembly Era"
With the deepening of the "light, thin and small" trend in consumer electronics and the improvement in the integration degree of automotive electronic components, the unit density of 01005 components on PCB boards has increased by more than 300% compared to five years ago. The assembly accuracy requirements have been tightened from the traditional ±0.05mm level to the ±0.025mm level. At the same time, it also needs to cope with technical challenges such as the tendency of components to absorb moisture and the difficulty of post-assembly detection. This has driven leading enterprises to launch targeted solutions from two aspects: equipment hardware upgrade and software algorithm optimization.
The FUJI NXTR A model achieves automatic replacement and replenishment of the feeder through an intelligent loading vehicle, supporting multi-variety mixed-line production and continuous feeding, significantly reducing line changeover time and manual intervention. Its modular design allows for free combination of 1R/2R modules, featuring a lightweight work head for quick replacement, and can be expanded as needed to increase production capacity. The mounting accuracy reaches ±15μm (in high-precision mode), equipped with dynamic height compensation function to deal with circuit board warping, and integrates multiple quality assurance features such as MPI assembly confirmation, IPS component detection, and 3D coplanarity detection. The new work head supports an ultra-wide component range from 0201 to 200×150mm, paired with dual mechanical hands at a top-level assembly speed of 120,000 cph, and a single track can handle large circuit boards of 750×610mm.
The iineo series of Europlacer's new generation surface mounters, ii-N1 and ii-N2. These new models are designed to meet the requirements of multi-variety, small-batch production and product trial assembly. They are versatile and intelligent. Each machine has up to 264 8mm feeder stations and there is a tray feeder area inside the machine that can accommodate up to 10 standard JEDEC trays, providing comprehensive short and loose material solutions; they can assemble circuit boards up to 1610mm x 600mm x 10mm and components ranging from 03015 (metric) to 99mm x 99mm x 34mm; the assembly speed is up to 30,000 CPH. The new models have also upgraded the RC main control software, adopting an intelligent PCB transfer system and an ultra-high-resolution vision system, perfectly integrating accuracy, efficiency and unparalleled flexibility, providing customers with a better choice.
Mycronic has launched a new generation of MYPro A40 surface mount solution, equipped with the latest MX7 high-speed mounting head technology. The new platform has increased the maximum mounting speed by 48%, and the mounting component size has been expanded by 6 times. MYPro A40DX, with its outstanding flexibility, enables high-mix users to achieve unprecedented production capacity! The rated maximum speed of this model reaches 59,000 CPH (per hour mounting quantity). This speed increase is attributed to the new MX7 mounting head, which integrates 7 independent mounting nozzles and is controlled by 14 independent Z-axis and θ-axis motors. The advanced and professional motion control system updates at a rate of 80,000 times per second. By optimizing up to 224 interchangeable station positions and the 640x510 mm circuit board working area for each soldering operation, it not only retains the original flexibility, but also raises the accuracy and speed to a new level.
The YAMAHA high-end and efficient module surface mount machine "YRM20" under the management of Guangsheng Generation is equipped with an ultra-high-speed turret-type RM mounting head and a straight-line FM mounting head for dissimilar components. It has significantly improved the "single mounting head solution" to achieve the fastest mounting speed of 115,000 CPH in a 2-stand, 2-mounting-head configuration. Additionally, the YRM20 is standardly equipped with various functions that maintain high-quality mounting, and the non-stop tray feeding device eATS30 enables efficient tray component replenishment operations and uninterrupted production, making it a versatile surface mount machine with outstanding productivity and versatility.
Green Transformation: The Efficiency Revolution of Lead-Free Processes
With the continuous upgrading of environmental protection regulations such as the EU RoHS 3.0 and China's "Measures for the Control of Pollution from Electronic Information Products", coupled with the growing demand from downstream customers for "carbon-neutral manufacturing", the penetration rate of lead-free processes in the consumer electronics sector has reached 98% by 2025. However, the new low-temperature solder (with the liquidus temperature reduced to 170℃) not only reduces the thermal stress of PCBs but also imposes higher requirements on the temperature control accuracy of welding equipment and the control of vacuum environments. Moreover, the industry is also facing pressure from rising energy costs, driving equipment manufacturers to continuously make breakthroughs in energy-saving technologies and environmental protection designs.
Several key welding systems under the Rehm brand, including the VisionXP+Vac vacuum reflow welding system, achieve high efficiency and energy savings by equipping with EC motors. This system reduces operating costs and emissions. Its vacuum module can directly remove gas holes, bubbles and pores while the solder is molten, without the need for external vacuum systems. The Condenso XS Smart gas-phase welding system adopts a new vertical opening and closing furnace design to optimize gas tightness for higher process repeatability accuracy. It supports manual or automatic loading system configurations and has multiple cooling options and a patented vacuum injection principle, enabling flexible adaptation to local automated production environments.
HELLER's newly launched Short Cycle Vacuum Reflow Oven (SCVR) in 2025, equipped with cutting-edge technology, empowers the high-end electronic manufacturing industry. It provides efficient and reliable solutions for high-precision welding scenarios in 5G communication, automotive electronics, aerospace, etc. This equipment integrates vacuum environment control and high-speed reflow processes, shortening the production cycle while significantly improving welding quality. It has become a benchmark in the field of precise welding.
Intelligent Reconfiguration: Digital Twinship贯穿 the entire production process
In the context where multi-variety and small-batch production has become the mainstream in the industry and the customer delivery cycle is continuously shortened, leveraging IIoT technology to achieve intelligent upgrading of the SMT production line has become the core path for enterprises to reduce costs and increase efficiency - the intelligent production line not only can increase the equipment utilization rate (OEE) from around 65% in traditional production lines to 92% through equipment interconnection and data analysis, but also can rely on sensors for real-time monitoring and AI algorithms to achieve predictive maintenance, reducing unplanned downtime by 70%, and at the same time can meet the compliance requirements of automotive electronics and medical electronics for full traceability of the production process.
ITW EAE has launched an innovative oxygen content closed-loop control system for the reflow oven field, specifically designed for the CATHOX™ nitrogen furnace, ensuring that the oxygen content is precisely controlled within the range of 200PPM to 2000PPM. This system can precisely maintain the set target within +/-100PPM in the low oxygen content range of 200PPM to 500PPM, and within 20% of the target set value in the high oxygen content range of 500PPM to 2000PPM. In the production mode, this closed-loop control system ensures the stability of PCB quality; while in the standby mode, it effectively reduces nitrogen consumption and automatically returns to the preset PPM value when the machine is reactivated for production. The patented CATHOX™ (thermal oxygen catalytic system) significantly reduces maintenance requirements while maintaining a clean production environment. During the reflow soldering process, this system can efficiently remove volatile compounds in the furnace, convert organic gas into hydrocarbons, and capture them through a filter. The design concept of Centurion™ is also reflected in its convenient maintainability; users can easily complete the operation without any tools during maintenance.
ASYS Group has launched the new GenS series of SMT intelligent equipment - upgrading traditional systems to intelligent solutions that can learn. The modular architecture can dynamically adapt to your needs, with intelligent energy management and reduced use of pneumatic components, helping to optimize carbon footprint and energy consumption. The multi-touch interface combined with multi-color technology ensures an excellent user experience; dynamic drive can reduce cycle time to less than 10 seconds. Make your production more intelligent and sustainable! Covering application areas such as handling, laser marking, printing, testing/programming, board separation, and SMD reel storage. Stronger performance, support for AI functions for upgrade, and sustainable design that achieves both ecological and economic benefits.
The perfect combination of Borui Advanced's fully automatic surface mount machine XJ10 and the SMT intelligent platform aims to provide customers with products and complete line solutions that are highly stable, precise, efficient, and cost-effective. XJ10 integrates an integrated casting structure, all-linear motor drive, all-linear closed-loop control system, high-speed lightweight HM mounting head, and is equipped with dual recognition systems of fly-shot camera and multi-functional camera, enabling precise mounting of 0201 components. It can be applied in various electronic mounting fields and meets the needs of different customers.
Ruitian's independently developed online laser welding machine features energy conservation and environmental protection, small weld points, and high adaptability. At the same time, its high efficiency, wide range of weldable materials, uniform heating with a small heat-affected zone, and fast heating speed are all advantages that have received high praise from customers in the market. It is also a product carrier that Ruitian Intelligence is committed to promoting the upgrading of intelligent manufacturing and helping China's manufacturing industry leap forward to "smart" manufacturing.
Key features of the exhibition: Dual drive by technology implementation and business connection.
With the breakthroughs made by local SMT enterprises in the domestication and substitution of core equipment, as well as the growing demand from downstream industries for "complete line solutions", this year's Munich Shanghai Electronic Equipment Exhibition will showcase the innovative achievements of local enterprises in the printing, mounting, testing, and welding processes. At the same time, it will provide customized technical connection services in line with the demands of specialized fields such as automotive electronics, new energy, and medical electronics.
Anda Intelligent has launched a digital spraying solution: integrating 3D printing, machine vision and digital modeling technologies, it can easily handle the surfaces of complex three-dimensional workpieces, achieving uniform coating and saving paint. It is a model of future intelligent production. It innovatively uses spray adhesive 3D printing technology, which solidifies and forms immediately after printing. Through multiple layers of stacking, it forms a 3D shape. There is no need to wait for other processes such as masking and carriers.
The thermal conductive adhesive precision dispensing system of axxon self-control adopts cutting-edge screw technology, presenting outstanding features such as low-pressure operation, no pulse discharge, and low shear strength. This design ingeniously avoids the problems of gel separation and volatilization caused by high-pressure environments, effectively preventing the occurrence of gel solidification. At the same time, the system's ability to supply glue continuously without pulses completely eliminates the backfilling phenomenon, significantly reducing the cycle time (CT). Moreover, the self-sealing characteristic of the screw itself ensures the stability and accuracy of the adhesive dispensing, with an error control within ±5%. This system also incorporates axxon's unique switch valve design and is supplemented by an intelligent suction function, not only effectively preventing the dripping and trailing of the adhesive, but also significantly reducing the occurrence rate of the large head and small head problems of the adhesive strip. This system can integrate advanced 3D line scanning laser technology to achieve precise detection of core parameters such as the length, width, height, area coverage, position accuracy, and poor point dispensing defects of the adhesive strip. This function can efficiently intercept defective products from flowing into the assembly process, thereby achieving full-loop monitoring of point dispensing detection while saving additional equipment costs and space resources.
The high-precision fully automatic visual printing machine Classic 1009BTBL from Desen Precision supports back-to-back printing, allowing the cleaning paper to be changed without moving the steel mesh; it covers all the printing process requirements for circuit boards; it has an extremely powerful alignment system, with automatic compensation for printing angles, capable of printing for 0201 and 01005 components, and is applied in 5G, semiconductor, Mini LED, automotive electronics, photovoltaic products, 3C, military aerospace, medical and other fields.
2026 Munich Shanghai Electronic Equipment Exhibition: Invite you to jointly explore the next decade of electronic manufacturing
From micro-level assembly to carbon-neutral production lines, SMT technology is reshaping industry boundaries through threefold transformations: miniaturization, intelligence, and greenness - miniaturization breaks through the bottleneck of component integration, intelligence solves the problem of flexible production, and greenness responds to global environmental protection calls. The 2026 Munich Shanghai Electronic Equipment Manufacturing Exhibition is not only a "testing ground" for technology implementation, but also a "connector" for enterprises to connect business opportunities and discuss the future. Besides the aforementioned enterprises, Shanghai Yishi Trading Co., Ltd. will also exhibit Panasonic's surface mounters and printers at the exhibition. The exhibition will also bring together ASM, KUKA, Nidek, Lu Yuan, Medemilaf, Indatech, JACCO, Asahi Kasei, Zhuhai Zixin, Jin Tu, Fuji De, Jiali, Meiya Technology, Tianding Electromechanical, Huajidi, Chenglian KaiDa, Zhishengwei, Zhonghe Xue, Kegai Machinery, Shouwei, etc., all high-quality enterprises in the SMT industry. We sincerely invite colleagues in the SMT industry to gather in Shanghai in March next year to attend this innovation event and unlock new possibilities in electronic manufacturing!
Picture: Some of the exhibitors in the SMT section of the 2026 Munich Shanghai Electronic Equipment Exhibition (rankings are not in any particular order)
Immediately secure your booth and join us for the electronic manufacturing event.
FUJI, Europlacer, Mycronic, Kurtz Ersa, Rehm, HELLER, ITW EAE, ASYS Group, Guangshengtimes, Borui Advanced, Yishi Trading, Ruitian Intelligent, Kuaikong, Andada, Zhexian, Desen and other leading enterprises in the industry will present their new products and new solutions at the 2026 Munich Shanghai Electronic Equipment Manufacturing Exhibition! Currently, only a few booths are left. Contact your exhibition sales immediately or call 021-20205553, Ms. Xing, to secure your last chance. Showcase your innovative strength on the pinnacle stage of electronic manufacturing technology and explore global business opportunities!